Sunday, September 16, 2018

IoT: Reliability Challenges for Electronic Circuits (English)



https://www.youtube.com/watch?v=hs55N9gP5P4&t=13m50s






...Radiation induced errors are a real problem today with both land-based and airborne equipment. This problem will con-tinue to worsen as devices increase in density and geometries continue to shrink...Due to process technology improvements, today's deep sub-micron SRAM-based devices have significantly increased sensitivity to radiation effects and are much more likely to be upset by a passing particle. Leading telecommunications and networking companies are now specifying qualification tests designed to evaluate radiation resistance of the integrated circuits they are planning to use in their communications systems. JEDEC has pub-lished a specification (JESD89) that specifies SER testing methodologies for integrated circuits.

In 2000, Sun's UltraSPARC II workstations were crashing at an alarming rate. The root cause of the problem was finally traced to IBM supplied SRAMs that were experiencing high upset rates due to charged particles causing soft errors in the memory system. Ultimately, not only did Sun switch memory vendors, they also designed new error check-ing and correcting logic and implemented it across the entire cache architecture.

Intel has announced plans to incorporate error-correction in its SRAM-intensive McKinley IA-64 processor, which is scheduled to be completed [at 2001]. The April 2002 International Reliability Physics Symposium (IRPS), held in Dallas, TX, had a special focused session discussing, "Radiation Induced Soft Errors in Silicon Components and Computer Systems. The large semicon-ductor companies were well represented at this session.
https://www.microsemi.com/document-portal/doc_view/130765-understanding-soft-and-firm-errors-in-semiconductor-devices-questions-and-answers

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